Mcm造句1. D - MCM is an effective method for realizing high-density assembly.
2. The planar diode is calculated by means of MCM and compared with the analytical solution. The relative error is 0.8%.
3. Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
4. Suitable for all soldering of SMT, MCM, HIC placement and low power, short - time iron soldering.
5. The mesoporous silica molecular sieves Zr - MCM - 41 were synthesized in ethylenediamine.
6. It points out the development tendency of MCM equipment,[/Mcm.html] with focal point on Underwater Unmanned Vehicle (UUV) and expendable mine disposal weapons.
7. As Multi-Chip-Module (MCM) operating frequencies increase, signal delay is seriously affected by interconnects. Interconnect becomes the dominant factor in determining system performance.
8. Tests results showed that this method could test MCM effectively at a shorter time with a fault coverage of more than 95%.
9. With MCM techniques, system performance in BER can be improved remarkably over frequency selective fading scenarios when high data rate is required.
10. Multichip module technology ( MCM ) is the optimal way of providing circuIt'system miniaturization.
11. As compared with traditional package technologies, multichip module(MCM) technology has the higher packing densities and the more excellent characteristics.
12. Two finite element thermal models for MCM with silicon substrate were built.
13. Objective:To investigate the MRI manefestations and characteristics of microcystic meningeoma (MCM), and to enhance the recognization and diagnosis or differential diagnosis levels.
14. Thin Film Multichip Modules (MCM)are new assembly process of chips, which can provide many advantages in improving system speed, decreasing system volume and cost.
15. MCM wants to help see that this development is livable, sustainable and as beautiful as possible.
16. Multichip module technology(MCM) is the optimal way of providing circuit system miniaturization.
17. Monte-Carlo method is called MCM for short. It is base on the probability theory and the computational mathematics, so MCM is also named statistical simulation approximate computation method.
18. Deals with multilayer distributed system construction, discussed Basic Monitor Control layer(BMC layer), Deriction Data Control layer (DDC layer), Monitor Control and Management layer (MCM layer).
19. This dissertation is on the research of S-band multi-chip module (MCM) 4-bit digital phase shifter and switch section.
20. From this point, M-ary Quadrature Amplitude Modulation (MQAM), MultiCarrier Modulation (MCM) and adaptive modulation techniques are good candidates in next generation mobile radio system.
21. By using FC or COB, die products are mounded in the MCM.
22. Bare chips find wide application in the fields of HIC and MCM, whose quality and reliability assurance have been concerned about.
23. The process data library, the design rule library and the package library were set up in CADENCEs MCM design system, based on high temperature co fire process.
24. This paper talks about the major supporting technologies for MCM package : the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding .
25. Supported by institute 38 of CECT, a S-band miniaturize T/R module based on MCM technology is studied in this paper. The experiments identify that this T/R module has a good performance.
26. As a result, bare dies are widely used in the new encapsulation technology currently, such as HIC and MCM, because of their advantages.
27. The communication interface circuit ( BMC and DDC layer, DDC and MCM layer ) was also discussed.
28. Thermal cycle test demonstrates that the fatigue life of 3 D - MCM are more than 1500 temperature cycles.
29. ICM , the Interdisciplinary Contest in Modeling, is a part of MCM.
30. In addition, this paper also studys, the 3 major supporting technologies of Flip Chip Bonding technology, for their development would largely impact, the promotion and application of FCB in MCM.