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61. Automatically stop and a coin box, IC card machines, electronic signs and display the car reversing the back door and monitor devices such as. 62. They turn into carbon dioxide generated by non-dispersive infrared detector, which were measured in water of the total carbon (TC) and inorganic carbon (IC). 63. The companys primary business is IC component packaging and test and memory module assembly. 64. The feature and specifications of WE series one piece control IC for spot welder have been briefly analyzed and introduced. Also, the practical questions in use have been explained. 65. A full wave simulator for the electromagnetic coupling of coplanar-type strip line in high speed digital microwave IC is described. 66. During the process of communication between different clock domains, metastability is likely to happen. This paper discusses several applications of different synchronizers in IC asynchronous design. 67. As an example , the application of National Semiconductor PLL IC LMX2315 is introduced in this paper which includes loop filter design and its registers configuration. 68. Adopted importable and military IC, controlled CMOS chip of switch power is of stability, reliability and long operative life. 69. To fit the calefactive IC industry in China(Sentence dictionary), we need to train more excellent IC designer from non-micro-electronics specialty. 70. The inferior colliculus (IC), as an important nucleus of auditory midbrain, is crucial for sound localization. 71. Radio frequency identification ( RFID ) technology is a combination of RF and IC chip technology. 72. The Elephant's Trunk Nebula is an elongated dark globule within the emission nebula IC 1396 in the constellation of Cepheus. 73. The main supply including various types of contact and contactless smart card IC. 74. A real-time one-lens white light information processing system is described in which spatial filtering is used to spot defects on IC photomasks. 75. Furthermore developed the device of IC card toll collector, the system application can improve extremely the work-efficiency, put a... 76. The IC has brought in an era of fundamental changes that it already has the characteristics of a second industrial revolution. 77. The over-molded package, holds together a samarium cobalt pellet, a pole piece and a true zero-speed Hall IC that has been optimized to the magnetic circuit. 78. With develop of the IC Technology, the integration level of the Circuit has improved constantly. 79. Since IC design entered nano-CMOS era, the drawbacks of global clock have become more and more severe in synchronous circuit, which drew asynchronous circuit back into research area. 80. In the first section, to study the acoustic response properties of the IC in the pipistrellus abramus, single unit extracellular recording with microelectrode was used in free field conditions. 81. Therefore, the magnetic stripe card to the IC card is a general trend of migration. 82. Defects or their effects are the main reason of invalidating circuit ( IC ) chips. 83. Through comparison, a scheme of "AC generating, DC energy feedback" electr ic clo sed loop transmission loading test bench is suggested and the hardware diagrams and work principle are presented. 84. The work principle of the audio decoder IC NE/SE567 and design of its circuit parameter is introduced. Some examples of application study are given. 85. This paper is intended to improve the regular structure of driving circuits by an analysis of factors that cause instant power drop of voltage in the multiple output of digital IC chips. 86. Grounded on practical JETCOS, this paper explicates the security of financial IC card in transaction flow and applied progress. 87. The paper introduces the structure and feature of the gate ban system using intelligent RF IC card. It expounds how to use encipher techique to ensure the system security. 88. Thin or thick films IC are formed on the surface of an insulating material such as glass or a ceramic. 89. It contains a bright knot, IC 349, about half an arcminute wide near Merope. 90. Die bonding plays a key role in effecting the quality and efficiency of IC production. The rapid development brings a challenge to the system in utmost stroke, speed, acceleration and accuracy.