bonder造句
(31) The series of tackifiers are manufactured high-grade high-alumina powder, corundum powder, micropowder inorganic bonder and additional agent.
(32) Now, Shusen provides the service such as the process of foam sprinkler, colour stripe, super bonder etc, we do our best to provide more products and service for customers.
(33) Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.
(34) Wire Bonder is an important device of IC package. With complex construction, its requirement of runtime and precision are very high.
(35) Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.
(36) This article introduces the microprogramming digital control wire bonder, designed according to the principle of the coordinate rotation computer.
(37) The auto Die Bonder for SOT - 23 transistor is a high - speed , high - precision, machinery electronics integrated equipment.
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