CMP造句
(1) Because the EJB container manages entity beans with container-managed persistence (CMP), the container automatically services all persistent storage access.
(2) Based on the CMP/A naming convention, the push-down method is called ejbFindByPrimaryKey, as the code snippet in Listing 6 shows.
(3) A container-managed method in a CMP bean must be created as an abstract method.
(4) Under the optimal conditions, about 45.7 % CMP was transformed to CTP.
(5) Then its CMP properties on hard disk substrate with nickel - phosphorous plated was studied.
(6) But CMP technology can obtain the glabrous and smooth plane in virtue of mechanical grinding and chemical eroding.
(7) Currently, the slurries used in CMP usually contain particles at nano scale to accelerate the material remove ratio (MRR) and to optimize the planarity.
(8) is required to be modified only for CMP 1.1 entity Enterprise JavaBeans (EJBs). Now, set the type-mapping element value to DB2, which is the type mapping name for your DB2 database.
(9) Typical chemical mechanical polishing (CMP) of copper layers on semiconductor devices involves using a hard pad in the first step and a soft pad for the barrier layer removal step.
(10) CMP has the function of indirect antivirus, protecting the liver and lulling.
(11) Electrochemical behaviours of copper during CMP were measured in situ in weak alkaline media with potassium ferricyanide as passivator.
(12) It does not map table relationship to CMP entity bean relationship.
(13) You can also use CMP Enterprise JavaBeans to wrap the audit log table and allow users to access information via the dynamic EJB query language.
(14) Nowadays Chip Multi-processors (CMP) is an effective way of dealing with escalating design complexity and power constraints, and Network-on-a-Chip (NoC) is crucial to manycore architecture.
(15) To demonstrate the use of CMP/A entity bean to push-down operations made on a stateful resource, we define the OperatingSystem WS-Resource using WSDL.
(16) We can therefore use this property in accomplishing dynamic correction, stacking and migration of CMP ga - ther.
(17) This dissertation tries to investigate some kinds of problems of IC manufacturability and yield by studying CMP process and test chip.
(18) Chemical-mechanical polishing (CMP) process is the key important planarization process in ULSI manufacturing. The RBR control applied on the CMP process is introduced in this paper.
(19) It is noted that there is a thin fluid film between the loaded asperities and the wafer being polished in CMP process, thereby a flow system with nano scale film is formed in.
(20) Once all of the push-down methods are mapped for a CMP/A bean, emit the UDPDMI for that bean, so that the deployer can fill this in with the appropriate logic.
(21) Then, from the balance point of the two phases, a new model, which can quantitatively describes the generation rate of oxidized layer on wafer surface in CMP is developed.
(22) The presented parallel algorithms can be referred in designing CMP system and optimizing other applications.
(23) Mathematical models were developed to simulate particle reduction in CMP slurry distribution systems.
(24) You might think after reading all these requirements that writing CMP entity beans is probably not for the faint-hearted.
(25) After the 2.2.15 cell line was planted 24 hours, CMP and Alcilovir ( ACV ) were added.
(26) The image of seismic discontinuous points is analogous to CMP stacking technique in reflection wave exploration.
(27) Compared with the original pachyman, there have been some changes in structure and characteristics of CMP. The polysaccharide carboxymethyl transformation had achieved certain result.
(28) Based on this mechanism, a new mathematical model characterizing the material removal rate in CMP process was developed by using micro-contact mechanics and particle size distribution theory.
(29) The modeling of the generation rate of oxidized layer in CMP will further the research of the CMP material removal mechanism and offer a direction to control the CMP process more accurately.
(30) Typical results from these tests show that filtration of newer ceria and alumina, and historic silica CMP slurries is beneficial in managing large particles.
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