solder造句
121. Our products produce excellent sealing and connecting performance with high mechanical strength. They can be welded to various kinds of hard solder, such as gold, silver and copper.
122. Also, DSC is employed to obtain the thermal deformation field of the assembly structures of flip chip on ceramic substrate, especially for the strain concentrating area around the solder joints.
123. The application of the finite element numerical simulation of stress-strain field distribution in the reliability study of the solder joints in microelectronic packaging has been reviewed.
124. At least one molding compound is formed and the molding compound, the first patterned solder resist layer and the second patterned solder resist layer are separated.
125. The results show that silver based electric materials ought to be smelted by graphite crucible, the clay crucible is suitable for smelting silver based solder.
126. RTI remote terminal interface. 10 % to 35 % clock duty cycle. Lead finish solder.
127. Solder Bumps: Round solder balls bonded to the pads of components used in face-down bonding techniques.
128. The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
129. The effect of gas hole location on SMT solder joint fatigue life has been analyzed by finite element method .
130. HOT BARThe hot wire is widely used in welding, solder reflow soldering.
131. Solder joint fatigue life is generally ascertained through accelerated temperature cycle test on electrical subassembly.
132. The aluminum solder paste has been used in the welding of Al-Al, Al-Al alloy and Al-stainless steel.
133. The apparatus (1) enables copper which has dissolved in a lead-free solder comprising tin as the main ingredient to precipitate as an intermetallic compound to separate the copper.
134. Assembles pipe sections , tubing and fittings , using screws , bolts, solder, plastic solvent, and caulking.
135. The protective technology of solder coat in production of multilayer printed circuit board is introduced.
136. Now, because HASL uses plumbic solder, many people think that its craft will be eliminated, replaced soon.
137. Do not use any warming device to heat up the solder paste.
138. This letter is to inform you that we have lately obtain a patent for an improved method of aluminum solder.
139. PCBs are transported by a conveyor system over the preheat, solder and cooling stations.
140. Transition fittings are available for adapting to new or existing threaded or solder joint ends.
141. AIM produces all the needed raw materials for it's solder products including powder, mediums and core wire flux.
142. This paper discusses the solder printing process technological key points and the common breakdown problem solution.
143. The ameliorative conditions of the supersonic atomizing equipment of producing lead - free solder powder are found.
144. Theoretical models are given to qualitatively explain the relationship between the solder joint volume and performance.
145. The oxide thinning process could not only reduce the coalescent resistance of solder alloys during melting but also make the complete removal of oxide with flux easier.
146. Therefore, it is necessary to study the reliability of this mixed solder joint.
147. Examples are insufficient solder, a misaligned component, a missing bypass capacitor and an open power pin.
148. With the miniaturized and lead-free development of electronic products, higher demand is put forward about solder.
149. With the downsizing of solder joints in microelectronic packaging, size effect in micro-joining plays an more important role in the constitutive equation of the solder joints.
150. Solder paste, screen printing, use ways, printing process course will decide the printing quality.
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